This answer is only applicable for soldering and desoldering PTH components used in modern multilayer(4-12) PCB.
Laptop and desktop motherboard manufacturers are continuing use of Lead Free Solder(LFS) for last 5-6 years. This kind of solders' melting point starts at 217 degree Centigrade(C). There are different kind of alloy composition used in manufacturing LFS, whose melting point differs. But only 217C - 227C LFS alloy used in motherboard manufacturing because of its lowest melting point in its class.
Now, it is not the matter of the solder used in your motherboard is leaded (63/37 at 183C) or lead free. If you use a traditional soldering iron / station, you will not be able to melt the solder on the power jack of a motherboard. Only because the motherboard is multilayer and has a wide ground / positive supply copper plate. This wider plate absorbs the energy from your soldering iron, and drops the tip temperature (drop may be between 70C - 100C than your set temp) within seconds. For tradition soldering station even with microprocessor controlled, it is near about impossible to rise and maintain the temperature immediately, because of the heater and sensor accuracy.
The watt and the temperature mentioned in your soldering station will not help in this matter. Rising the temperature will probably damage the solder pad on the board and will not melt the solder on the other side of the board.
To work on modern motherboard, it is necessary to have latest soldering station from any reputed brand, whose temperature rises to 350C within 5 seconds and minimum temperature drop (30C - 50C). Always set your soldering station temperature minimum (solder melting temp + 70C) and increase if required as per application. Using of proper size iron TIP is necessary. Before soldering motherboard it is necessary to clean the iron tip with a damped sponge(made with cellulose) and brass wool / inox wool.
Before desoldering the PTH components, it is necessary to clean the terminals with isopropyl alcohol. After this process, add some new solder to the terminals of the component to be desoldered.